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Adaps Photonics

Category: Computer Vision

Adaps Photonics (灵明光子) is a leading designer of high-performance 3D sensing chips specializing in Single-Photon Avalanche Diode (SPAD) and direct Time-of-Flight (dToF) technologies for automotive, consumer, and industrial applications. Adaps Photonics was founded in 2018. The company is led by Kai Zang. Based in Shenzhen, China. Team size: 100+. Total funding raised: $150.0M. Latest round: Series C3. Key investors include Meituan Long-Z, SAIC Motor, Xiaomi, OPPO, Lightspeed China Partners, Gaorong Capital, ZhenFund, Zhejiang State-owned Asset Platform.

Founded
2018
Headquarters
Shenzhen, China
Team size
100+
Total funding
$150.0M

Value proposition

Provides world-class SPAD-based dToF chips that offer superior photon detection efficiency (PDE), ultra-high resolution, and lower power consumption through advanced BSI 3D-stacking technology.

Products and solutions

ADS6000 Series (e.g., ADS6311 'Hawk'): High-resolution SPADIS chips for automotive solid-state LiDAR and robotics., ADS6400 Series (e.g., ADS6401 'Swift'): Low-power, high-accuracy dToF sensors for smartphones and XR/AR wearable devices., ADS3000 Series (e.g., ADS3003): High-resolution dToF area-array chips for indoor/outdoor 3D modeling and depth sensing., Silicon Photomultiplier (SiPM) Chips: High-sensitivity sensors for long-range LiDAR with industry-leading 905nm PDE., Woodpecker dToF Modules: Integrated area-array modules for depth monitoring and facial recognition (developed with partners).

Unique value

One of the few global companies capable of designing and mass-producing 3D-stacked dToF sensors; their ADS3003 was the first domestic chip to achieve the high-level 3D stacking process comparable to Apple/Sony's LiDAR scanners.

Target customer

Automotive LiDAR manufacturers, smartphone OEMs, AR/VR/MR device makers, robotics developers, and smart home IoT providers.

Industries served

Automotive (LiDAR & ADAS), Consumer Electronics (Smartphones & Laptops), Robotics & AGVs, Extended Reality (AR/VR/MR), Industrial Automation

Technology advantage

Maintains a full-stack proprietary SPAD IP portfolio. Key advantages include BSI (Back-Illuminated) 3D stacking technology which bonds sensor and logic wafers, and achieving AEC-Q100/AEC-Q102 Grade 1 automotive reliability certifications for its core chipsets.

How they differentiate

One of the few global players (alongside Sony and Apple) utilizing advanced BSI (Back-Illuminated) 3D stacking technology for SPAD sensors. Differentiates through its high-resolution SPADIS line, providing superior photon detection efficiency (PDE) and lower power consumption for solid-state LiDAR and mobile dToF.

Main competitors

Sony Semiconductor, STMicroelectronics, Fortsense (阜时科技), VisionNav (芯视界)

Key partnerships

Zhiyang Innovation (Acquisition partner/Parent-to-be), O-Film (Joint dToF module development), SAIC Motor, Xiaomi, and OPPO (Strategic investors and supply chain partners), Meituan (Investor and robotics application partner), LiDAR Tier-1 suppliers like RoboSense and Hesai Technology

Notable customers

Qualcomm, ArcSoft, O-Film, RoboSense (ecosystem partner), Major Smartphone OEMs (undisclosed)

Major milestones

Secured Series C3 funding from Zhejiang State-owned Assets in Sep 2025, Proposed acquisition of controlling stake by Zhiyang Innovation (智洋创新) announced in late 2024, Mass production of ADS6000 series SPAD chips for automotive solid-state LiDAR in 2024, Collaborated with Qualcomm to launch 'Director Mode' on Snapdragon 8 Gen 2 in 2022

Growth metrics

Entered mass production stage for automotive LiDAR in 2024; revenue scale in 2024 significantly exceeded previous years.

Market positioning

Leading Chinese domestic challenger in high-performance 3D sensing chips; Tier-2 global specialist for automotive and consumer electronics.

Geographic focus

Primarily Mainland China (domestic substitution play), with expansion into global supply chains via partners like Qualcomm.

Patents and IP

Holds numerous domestic and international patents in SPAD device design, Time-to-Digital Converter (TDC) loop architectures, and 3D imaging algorithms (Specific counts not disclosed but categorized as a National 'Little Giant' enterprise).

About Kai Zang

Kai Zang is the Co-founder and CEO of Adaps Photonics. He holds a Ph.D. in Electrical Engineering from Stanford University, where he spent six years in the Harris Group researching Single-Photon Avalanche Diode (SPAD) devices and 3D imaging systems. Before founding Adaps Photonics in 2018, he was a senior researcher in the field of photonics, having authored over 40 academic papers and holding multiple patents in semiconductor design. He is a recognized high-level talent under China's Qiming Program.

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