BOS Semiconductors
Category: AI Chips / Semiconductors
A Korean automotive fabless company specializing in chiplet-based high-performance AI semiconductor solutions for autonomous driving and intelligent mobility applications. BOS Semiconductors was founded in 2022. The company is led by Jaehong Park. Based in Seongnam, South Korea. Team size: 220+. Total funding raised: $62.2M. Latest round: Series A. Key investors include ["Hyundai Motor Group","Kia Corporation","Korea Development Bank","KB Investment","Smilegate Investment","Atinum Investment","Uamco-PIA Partners","Shinyoung Securities-BSK Investment","Woori Venture Partners","HB Investment","EN Venture Partners"].
- Founded
- 2022
- Headquarters
- Seongnam, South Korea
- Team size
- 220+
- Total funding
- $62.2M
Value proposition
Provides industry's first automotive chiplet AI accelerator enabling OEMs to add high-performance AI capability (up to 250 TOPS) to existing systems without complete replacement, offering modular scalability, cost optimization through chiplet architecture, and automotive-grade safety compliance.
Products and solutions
["Eagle-N: 250 TOPS chiplet AI accelerator for ADAS and IVI systems with PCIe Gen5/UCIe interfaces","Eagle-A: 150 TOPS all-in-one ADAS SoC (standalone solution)","Eagle Chiplet SoC Family: Scalable portfolio covering low-end, mid-range, and high-end ADAS applications","Multi-die configuration solutions: Combined Eagle-A + Eagle-N systems via UCIe/PCIe interconnects"]
Unique value
Pioneered the automotive industry's first chiplet-based AI accelerator SoC (Eagle-N), introducing modular semiconductor architecture to automotive sector. First to combine chiplet technology with automotive-grade safety requirements, enabling flexible add-on AI acceleration without system replacement.
Target customer
Global automotive OEMs (including European manufacturers), Tier-1 automotive suppliers, ADAS/autonomous driving system developers, and edge AI application providers (robotics, drones)
Industries served
["Automotive (ADAS, Autonomous Driving, In-Vehicle Infotainment)","Software-Defined Vehicles","Robotics","Drones and UAVs","Edge AI Computing","Mobility Intelligence Systems"]
Technology advantage
Leverages chiplet architecture to divide large dies into optimal sizes, improving manufacturing yield and reducing costs by 30-50% vs monolithic designs. Combines Tenstorrent's RISC-V based Tensix NPU cores (250 TOPS dense performance) with UCIe/PCIe Gen5 standard interfaces for ecosystem compatibility. Achieves performance-power-cost optimization through advanced packaging and modular design, enabling scalable solutions from 125 to 250 TOPS.
How they differentiate
Industry's first automotive chiplet-based AI accelerator enabling modular add-on AI capability (up to 250 TOPS) without complete system replacement. Combines Tenstorrent's RISC-V based Tensix NPU cores with UCIe/PCIe Gen5 standard interfaces, achieving 30-50% cost reduction vs monolithic designs while maintaining automotive-grade safety compliance.
Main competitors
["NVIDIA (Drive AGX SoC, Thor platform)","Intel Mobileye (EyeQ series)","Qualcomm (Snapdragon Ride)"]
Key partnerships
["Tenstorrent: Strategic IP partner providing RISC-V based Tensix NPU cores and chiplet ecosystem technology","Intel: Foundry and packaging partner for automotive AI innovation","Ceva: AI DSP IP provider for next-generation ADAS platforms","Hyundai Motor Group: Strategic investor and automotive partner","Samsung Catalyst Fund: Strategic investor with foundry ecosystem access","Eclipse Ventures: Lead Series A investor","European automotive OEM: Development contract for ADAS chiplet system (announced March 2025)","UCIe Consortium: Industry alliance member for chiplet interconnect standards"]
Notable customers
["European automotive OEM (development contract for ADAS chiplet)","LIG Nex1 (strategic partnership for physical AI drones/robots)"]
Major milestones
["Founded in May 2022 by Samsung Electronics veterans","Seed investment from Hyundai Motor Group (August 2022)","ISO 26262 Functional Safety Management Certification (April 2024)","Eagle-N chiplet AI accelerator launch in partnership with Tenstorrent (December 2024)","Development contract with European OEM for ADAS chiplet (March 2025)","Strategic partnership with Intel for automotive AI innovation (April 2025)","Strategic partnership with LIG Nex1 for physical AI solutions (December 2025)","Series A funding of 87 billion KRW (~$60.2M) (February 2026)"]
Growth metrics
Expanded from startup to 220+ employees within 3 years. Secured European OEM development contract and strategic partnerships with Intel and LIG Nex1. Achieved ISO 26262 certification and production tape-out milestones.
Market positioning
Emerging challenger in automotive AI semiconductor space, focusing on chiplet architecture innovation. Positioned between established players (NVIDIA, Mobileye) and traditional automotive semiconductor suppliers, targeting mid-to-high performance ADAS/autonomous driving applications.
Geographic focus
Headquarters in South Korea with global expansion strategy. Primary markets include South Korea (Hyundai Motor Group ecosystem), Europe (secured OEM development contract), and expanding to North America and Asia-Pacific regions.
Patents and IP
No registered patents publicly disclosed as of latest update. Utilizes licensed IP from Tenstorrent (Tensix NPU cores) and Ceva (AI DSP). Holds ISO 26262 Functional Safety Management Certification. Member of UCIe Consortium (joined Oct 2024) and VESA standard bodies.
About Jaehong Park
Former Vice President of Samsung Electronics System LSI and Foundry Division, with approximately 23 years of experience in semiconductor development, foundry ecosystem establishment, and Exynos SoC design.
Official website: https://www.bos-semi.com