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Eliyan

Category: AI Infrastructure

A semiconductor startup developing high-performance chiplet interconnect technology designed to eliminate the 'memory wall' and 'IO wall' in AI and high-performance computing (HPC) systems. Eliyan was founded in 2021. The company is led by Ramin Farjadrad. Based in Santa Clara, USA. Team size: 11-50. Total funding raised: $200.0M. Latest round: Strategic round ($50.0M, Mar 2024). Key investors include ["Samsung Catalyst Fund","Tiger Global Management","Intel Capital","SK Hynix","Micron Ventures","Tracker Capital","Celesta Capital","AMD","Arm","Coherent","Meta"].

Founded
2021
Headquarters
Santa Clara, USA
Team size
11-50
Total funding
$200.0M

Value proposition

Enables the performance of advanced packaging (like silicon interposers) using standard organic substrates, significantly reducing costs and power consumption while increasing bandwidth density for multi-die systems.

Products and solutions

["NuLink™ PHY (1.0 & 2.0)","NuGear™","Universal Memory Interconnect (UMI)","Bunch of Wires (BoW)"]

Unique value

Eliyan's technology allows for high-performance chiplet integration on standard organic substrates, bypassing the need for expensive and supply-constrained silicon interposers used in traditional advanced packaging.

Target customer

Hyperscale data center operators, AI chip designers (fabless semiconductor companies), and major foundries/memory manufacturers.

Industries served

["Artificial Intelligence (Generative AI Infrastructure)","High-Performance Computing (HPC)","Data Centers & Cloud Computing","Edge Computing","Automotive & Graphics"]

Technology advantage

NuLink technology is a backwards-compatible superset of the UCIe standard, offering superior bandwidth density and power efficiency (e.g., 2.2Tbps/mm beachfront bandwidth at 130um pitch).

How they differentiate

Eliyan differentiates by enabling high-performance chiplet interconnects (NuLink™) on standard organic substrates, eliminating the need for expensive and supply-constrained silicon interposers (like TSMC's CoWoS).

Main competitors

["Ayar Labs","Alphawave Semi","Kandou Bus","BlueCheetah Analog Design"]

Key partnerships

["Open Compute Project (OCP)","UCIe Consortium","Samsung Foundry","TSMC","Intel Capital","SK Hynix","Micron Ventures","Arm Total Design ecosystem","AMD","Meta"]

Notable customers

["Samsung Foundry","Hyperscale Data Center Operators","AI Chip Designers"]

Major milestones

["Closed $40M Series A (Nov 2022)","First silicon demonstrated in 5nm (2023)","Secured $60M Series B and $50M Strategic funding (Mar 2024)","Demonstrated NuLink PHY on Samsung 3nm (SF3)","BoW adopted as OCP standard","Joined Arm Total Design ecosystem (Nov 2025)","Secured $50M Strategic investments from AMD, Arm, Coherent, Meta (Jan 2026)"]

Growth metrics

Successfully demonstrated industry-first 64Gbps/bump chiplet interconnect on 3nm process; expanded headcount.

Market positioning

Specialized semiconductor IP provider focusing on the 'interconnect wall' for Generative AI and High-Performance Computing (HPC) infrastructure.

Geographic focus

North America (R&D), Asia-Pacific (Foundry and Memory partnerships)

Patents and IP

22+ registered patents (including Patent No. 12248421); Founder holds over 130 granted and pending patents.

About Ramin Farjadrad

Ramin Farjadrad is a highly accomplished serial entrepreneur and technical visionary in the semiconductor industry. Before founding Eliyan, he co-founded Aquantia, where he served as CTO and VP of Networking/Automotive PHYs, leading the company through its IPO and subsequent $452M acquisition by Marvell. He also co-founded Velio Communications (acquired by Rambus/LSI Logic) and held senior roles at Rambus.

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