Eliyan
Category: AI Infrastructure
A semiconductor startup developing high-performance chiplet interconnect technology designed to eliminate the 'memory wall' and 'IO wall' in AI and high-performance computing (HPC) systems. Eliyan was founded in 2021. The company is led by Ramin Farjadrad. Based in Santa Clara, USA. Team size: 11-50. Total funding raised: $200.0M. Latest round: Strategic round ($50.0M, Mar 2024). Key investors include Samsung Catalyst Fund, Tiger Global Management, Intel Capital, SK Hynix, Micron Ventures, Tracker Capital, Celesta Capital, AMD, Arm, Coherent, Meta.
- Founded
- 2021
- Headquarters
- Santa Clara, USA
- Team size
- 11-50
- Total funding
- $200.0M
Value proposition
Enables the performance of advanced packaging (like silicon interposers) using standard organic substrates, significantly reducing costs and power consumption while increasing bandwidth density for multi-die systems.
Products and solutions
NuLink™ PHY (1.0 & 2.0), NuGear™, Universal Memory Interconnect (UMI), Bunch of Wires (BoW)
Unique value
Eliyan's technology allows for high-performance chiplet integration on standard organic substrates, bypassing the need for expensive and supply-constrained silicon interposers used in traditional advanced packaging.
Target customer
Hyperscale data center operators, AI chip designers (fabless semiconductor companies), and major foundries/memory manufacturers.
Industries served
Artificial Intelligence (Generative AI Infrastructure), High-Performance Computing (HPC), Data Centers & Cloud Computing, Edge Computing, Automotive & Graphics
Technology advantage
NuLink technology is a backwards-compatible superset of the UCIe standard, offering superior bandwidth density and power efficiency (e.g., 2.2Tbps/mm beachfront bandwidth at 130um pitch).
How they differentiate
Eliyan differentiates by enabling high-performance chiplet interconnects (NuLink™) on standard organic substrates, eliminating the need for expensive and supply-constrained silicon interposers (like TSMC's CoWoS).
Main competitors
Ayar Labs, Alphawave Semi, Kandou Bus, BlueCheetah Analog Design
Key partnerships
Open Compute Project (OCP), UCIe Consortium, Samsung Foundry, TSMC, Intel Capital, SK Hynix, Micron Ventures, Arm Total Design ecosystem, AMD, Meta
Notable customers
Samsung Foundry, Hyperscale Data Center Operators, AI Chip Designers
Major milestones
Closed $40M Series A (Nov 2022), First silicon demonstrated in 5nm (2023), Secured $60M Series B and $50M Strategic funding (Mar 2024), Demonstrated NuLink PHY on Samsung 3nm (SF3), BoW adopted as OCP standard, Joined Arm Total Design ecosystem (Nov 2025), Secured $50M Strategic investments from AMD, Arm, Coherent, Meta (Jan 2026)
Growth metrics
Successfully demonstrated industry-first 64Gbps/bump chiplet interconnect on 3nm process; expanded headcount.
Market positioning
Specialized semiconductor IP provider focusing on the 'interconnect wall' for Generative AI and High-Performance Computing (HPC) infrastructure.
Geographic focus
North America (R&D), Asia-Pacific (Foundry and Memory partnerships)
Patents and IP
22+ registered patents (including Patent No. 12248421); Founder holds over 130 granted and pending patents.
About Ramin Farjadrad
Ramin Farjadrad is a highly accomplished serial entrepreneur and technical visionary in the semiconductor industry. Before founding Eliyan, he co-founded Aquantia, where he served as CTO and VP of Networking/Automotive PHYs, leading the company through its IPO and subsequent $452M acquisition by Marvell. He also co-founded Velio Communications (acquired by Rambus/LSI Logic) and held senior roles at Rambus.
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Official website: https://eliyan.com
