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Frore Systems

Category: AI Infrastructure

A developer of solid-state active cooling chips designed to replace traditional fans and heat sinks in consumer electronics and high-power AI infrastructure. Frore Systems was founded in 2018. The company is led by Seshu Madhavapeddy. Based in San Jose, USA. Team size: 100-200. Total funding raised: $340.0M. Latest round: Series D. Key investors include Fidelity Management & Research Company, StepStone Group, MVP Ventures, Qualcomm Ventures, Mayfield Fund, Clear Ventures, Addition, Top Tier Capital Partners, Alumni Ventures.

Founded
2018
Headquarters
San Jose, USA
Team size
100-200
Total funding
$340.0M

Value proposition

Eliminates thermal throttling by providing high-pressure, silent, and dust-proof active cooling in a slim, solid-state form factor, allowing devices to run up to 2x faster without increasing size.

Products and solutions

AirJet Mini / Mini Slim (For compact consumer electronics and tablets), AirJet Pro (For high-performance laptops and handheld gaming devices), AirJet PAK (Scalable thermal modules for AI edge hardware and data centers), AirJet SSD (Integrated cooling solutions for high-speed NVMe storage), LiquidJet (Direct-to-chip liquid cooling coldplate for AI data centers), LiquidJet Nexus (Integrated coldplate system for 1/2U AI compute trays like NVIDIA Kyber)

Unique value

The world's first 'solid-state' active cooling solution; it uses no rotating blades, instead utilizing membranes vibrating at ultrasonic frequencies to generate high-velocity cooling jets.

Target customer

OEMs of laptops, smartphones, SSDs, mini-PCs, and manufacturers of AI accelerators and data center hardware.

Industries served

Consumer Electronics, Artificial Intelligence & Data Centers, Storage & Memory, Automotive (Infotainment & ADAS), Industrial IoT

Technology advantage

Generates 10x higher back pressure than traditional fans, allowing for much thinner device designs (2.8mm thickness) while remaining silent and resistant to dust ingress.

How they differentiate

Frore Systems utilizes proprietary MEMS (Micro-Electro-Mechanical Systems) technology with ultrasonic vibrating membranes to create high-pressure airflow, whereas competitors rely on traditional mechanical fans (Delta/Sunon) or the Peltier effect (Phononic). AirJet is silent, dust-proof, and significantly thinner (2.8mm) than traditional active cooling.

Main competitors

Phononic, Delta Electronics, Sunonwealth Electric Machine (Sunon)

Key partnerships

ZOTAC (Integrated into the ZBOX PI430AJ mini-PC), Intel (Collaboration on thermal standards for thin-and-light laptops), Qualcomm (Strategic investor and mobile integration partner), OWC & Sabrent (High-performance external storage and SSD cooling), PC Partner Group (Manufacturing and distribution scaling)

Notable customers

ZOTAC, OWC (Other World Computing), Sabrent, UGREEN, Intel (Collaborative Partner)

Major milestones

Exited stealth mode at CES 2023 with the launch of AirJet Mini and AirJet Pro., Launched the first consumer product, the ZOTAC ZBOX PI430AJ, the world's first fanless active-cooled mini PC., Secured $143M Series D in March 2026 at $1.64B valuation to scale production for the AI data center and edge market., Recognized as a CES 2024 Innovation Awards Honoree., Launched LiquidJet Nexus in March 2026, an integrated liquid cooling system for 1/2U AI compute trays like NVIDIA Kyber., Achieved unicorn status with $1.64B valuation following Series D close in March 2026.

Growth metrics

Achieved 'Unicorn' status with a post-money valuation of approximately $1.64 billion following the Series D round in March 2026.

Market positioning

Premium solid-state thermal management provider for AI infrastructure, high-performance computing, and ultra-thin consumer electronics.

Geographic focus

Global, with primary R&D in North America (Silicon Valley) and manufacturing/supply chain partnerships in Asia (Taiwan/China).

Patents and IP

Holds a robust portfolio of proprietary MEMS (Micro-Electro-Mechanical Systems) and thermal management patents; specific IP covers the ultrasonic membrane actuation and fluid dynamic design of the AirJet chambers.

About Seshu Madhavapeddy

Seshu Madhavapeddy has over 25 years of experience in the semiconductor and mobile industries. He previously served as Senior Vice President at Samsung Electronics and spent 15 years at Qualcomm as Vice President of Product Management, where he led the development of various mobile and IoT technologies.

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