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LightSpeed Photonics

Category: AI Infrastructure

LightSpeed Photonics develops high-speed optical interconnects for AI data centers, combining optical interconnects with processors to create modular, heterogeneous System-in-Packages (SiPs) called LightSiP™. LightSpeed Photonics was founded in 2021. The company is led by Rohin Kumar Y. Based in Singapore, Singapore. Team size: 11-50. Total funding raised: $8.5 million (including grants). Latest round: Pre-Series A. Key investors include pi Ventures, 500 Global, Indian Accelerator, 8X Ventures, Java Capital.

Founded
2021
Headquarters
Singapore, Singapore
Team size
11-50
Total funding
$8.5 million (including grants)

Value proposition

Reduces data latency, footprint, and power consumption while increasing data bandwidth and performance-per-watt through compact, scalable, and power-efficient opto-electronic System-in-Packages (SiPs).

Products and solutions

LightSiP™ (Modular Compute+Interconnect SiP), LightKonnect™ (Solderable NPO Optical Interconnect), PCIe-over-Fiber Solutions, Optical Interconnect Solutions for AI Infrastructure, Near-Packaged Optics for Short-Range Applications

Unique value

Pioneers near-packaged optics for short-range applications, avoiding costly silicon photonics and co-packaging with silicon processors. Uses proven components for faster time-to-market and higher reliability.

Target customer

AI data center operators, cloud service providers, and enterprises requiring high-performance computing infrastructure.

Industries served

AI Infrastructure, Data Centers, Cloud Computing, High-Performance Computing (HPC)

Technology advantage

Proprietary LightSiP™ technology enables modular, heterogeneous integration of compute and interconnects, offering scalability without requiring system redesigns.

How they differentiate

LightSpeed Photonics differentiates itself by using near-packaged optics with proven components, enabling faster time-to-market, easier integration, and higher reliability compared to competitors relying on silicon photonics and co-packaging.

Main competitors

iPronics, Lightmatter, Photonic Technologies

Key partnerships

Applied Ventures (Applied Materials), Arrow Electronics, A*Star IME (Singapore), OEM/ODM Partners, EMS Partners, 8X Ventures, pi Ventures, Infraeo, Kaynes SemiCon

Notable customers

N/A

Major milestones

Raised $6.5 million in Pre-Series A funding led by pi Ventures (November 2025), Developed LightSiP™ technology for modular compute+interconnect solutions, Launched LightKonnect™ solderable NPO optical interconnect, Signed strategic MoU with Infraeo for NPO and PCIe-over-Fiber (March 2026), Signed MoU with Kaynes SemiCon as India's first paying OSAT customer (August 2024), Expanded global operations with presence in Singapore, India, US, and Japan

Growth metrics

N/A (Private company)

Market positioning

Positioned as a provider of scalable, high-bandwidth optical interconnect solutions for AI data centers and high-performance computing, focusing on modular compute+interconnect heterogeneous System-in-Package (LightSiP™) technology.

Geographic focus

Primarily targeting the Asia-Pacific region with expansion into global AI markets, leveraging Singapore's strategic location.

Patents and IP

CEO holds over 20 patents in embedded systems, advanced packaging, and co-packaged optics. Company has filed 28 patents with 10 awarded as of 2025.

About Rohin Kumar Y

Second-time entrepreneur with 10+ years in research, R&D startups, and teaching. Former STMicroelectronics R&D engineer; PhD in Cosmology from University of Delhi. 5 solo cosmology publications, 6+ electronics packaging conference papers. Prolific inventor holding over 20 patents in embedded systems, advanced packaging, and co-packaged optics.

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