LightSpeed Photonics
Category: AI Infrastructure
LightSpeed Photonics develops high-speed optical interconnects for AI data centers, combining optical interconnects with processors to create modular, heterogeneous System-in-Packages (SiPs) called LightSiP™. LightSpeed Photonics was founded in 2021. The company is led by Rohin Kumar Y. Based in Singapore, Singapore. Team size: 11-50. Total funding raised: $8.5 million (including grants). Latest round: Pre-Series A. Key investors include pi Ventures, 500 Global, Indian Accelerator, 8X Ventures, Java Capital, YourNest.
- Founded
- 2021
- Headquarters
- Singapore, Singapore
- Team size
- 11-50
- Total funding
- $8.5 million (including grants)
Value proposition
Reduces data latency, footprint, and power consumption while increasing data bandwidth and performance-per-watt through compact, scalable, and power-efficient opto-electronic System-in-Packages (SiPs).
Products and solutions
LightSiP™ (Modular Compute+Interconnect SiP), LightKonnect™ (Solderable NPO Optical Interconnect, up to 400 Gbps), LightPCIe™ (PCIe-over-Fiber), Optical Interconnect Solutions for AI Infrastructure, Near-Packaged Optics for Short-Range Applications
Unique value
Pioneers near-packaged optics for short-range applications, avoiding costly silicon photonics and co-packaging with silicon processors. Uses proven components for faster time-to-market and higher reliability.
Target customer
AI data center operators, cloud service providers, and enterprises requiring high-performance computing infrastructure.
Industries served
AI Infrastructure, Data Centers, Cloud Computing, High-Performance Computing (HPC)
Technology advantage
Proprietary LightSiP™ technology enables modular, heterogeneous integration of compute and interconnects, offering scalability without requiring system redesigns.
How they differentiate
LightSpeed Photonics differentiates itself by using near-packaged optics with proven components, enabling faster time-to-market, easier integration, and higher reliability compared to competitors relying on silicon photonics and co-packaging.
Main competitors
iPronics, Lightmatter, Photonic Technologies
Key partnerships
Applied Ventures (Applied Materials), Arrow Electronics, A*Star IME (Singapore), OEM/ODM Partners, EMS Partners, 8X Ventures, pi Ventures, Infraeo, Kaynes SemiCon
Notable customers
N/A
Major milestones
Raised $6.5 million in Pre-Series A funding led by pi Ventures (November 2025), Developed LightSiP™ technology for modular compute+interconnect solutions, Launched LightKonnect™ solderable NPO optical interconnect, Signed strategic MoU with Infraeo for NPO and PCIe-over-Fiber (March 2026), Signed MoU with Kaynes SemiCon as India's first paying OSAT customer (August 2024), Expanded global operations with presence in Singapore, India, US, and Japan, EE Times feature on 400-Gbps solderable NPO; seeking additional $15M; OEM pilots underway; targeting initial revenue by FY-end and $3M revenue in 2027-28 (May 2026)
Growth metrics
N/A (Private company)
Market positioning
Positioned as a provider of scalable, high-bandwidth optical interconnect solutions for AI data centers and high-performance computing, focusing on modular compute+interconnect heterogeneous System-in-Package (LightSiP™) technology.
Geographic focus
Primarily targeting the Asia-Pacific region with expansion into global AI markets, leveraging Singapore's strategic location.
Patents and IP
CEO holds over 20 patents in embedded systems, advanced packaging, and co-packaged optics. Company has filed 28 patents with 10 awarded as of 2025.
About Rohin Kumar Y
Second-time entrepreneur with 10+ years in research, R&D startups, and teaching. Former STMicroelectronics R&D engineer; PhD in Cosmology from University of Delhi. 5 solo cosmology publications, 6+ electronics packaging conference papers. Prolific inventor holding over 20 patents in embedded systems, advanced packaging, and co-packaged optics.
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Official website: https://lightspeedphotonics.com