Funding
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Suanmiao Tech has raised nearly RMB 1 billion to mass-produce 100 percent domestic 3D AI inference c...
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The article updates the infrastructure player map with a domestic CN chip entrant using 3D IC architecture to bypass memory bottlenecks, signaling structural shifts in supply chain resilience and silicon design.
NoveltySignificance
AI Infra · Player MapGeopoliticsSilicon Substrate
Suanmiao Tech has raised nearly RMB 1 billion to mass-produce 100 percent domestic 3D AI inference chips designed to break the memory wall. Utilizing 3D TokenPU architecture, the A4 chip demonstrates up to 2.19x the throughput of Nvidia H200 on large language models. This reflects a systemic shift toward 3D IC stacking to ensure supply chain resilience. Architectural innovation is now the primary driver for scaling autonomous AI infrastructure. 🚀
