NcodiN secured a €16M investment to industrialize its NConnect platform, leveraging the "world's sma...
The AMW Read
NcodiN's silicon-integrated photonics updates the AI infrastructure landscape by addressing the interconnect bottleneck, a critical structural force for scaling compute efficiency.
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AI Infra · Player MapSilicon Substrate
NcodiN secured a €16M investment to industrialize its NConnect platform, leveraging the "world's smallest laser" integrated onto silicon chips. This technology directly addresses the AI hardware bottleneck, where electrical copper interconnects limit performance and energy efficiency. By achieving ultra-low energy consumption—less than 0.1 pJ/bit—and integration density of over 10,000 devices/mm², this optical interposer is essential for enabling the next generation of wafer-scale superchips and AI factories built on chiplet architectures. Photonics is rapidly becoming the non-negotiable layer for future AI computing power.
