Skip to main content
Back to News
EUCLYD closes €200M+ Series A co-led by Samsung; Peter Wennink joins as chairman
Funding
2 min read
NL

EUCLYD closes €200M+ Series A co-led by Samsung; Peter Wennink joins as chairman

The AMW Read

New European AI-silicon entrant with a €200M+ Series A and Samsung/ASML-linked governance meaningfully updates the infrastructure player map; silicon architecture is the headline subject.
NoveltySignificance
AI Infra · Player MapSilicon Substrate
Euclyd
Euclyd

AI Chips / Semiconductors

View Company Profile

EUCLYD closes €200M+ Series A co-led by Samsung; Peter Wennink joins as chairman

Eindhoven-based semiconductor systems startup EUCLYD has raised a Series A of more than €200 million (~$220M) to build ultra-efficient infrastructure for foundation AI models. The round was co-led by Samsung, Somerset Capital Partners, the EQT-managed Scaleup Europe Fund, and Innovation Industries, with further backing from Denmark’s EIFO, imec.xpand, the Brabant Development Agency (BOM), and Quadri. Founded in 2024 by Bernardo Kastrup and Atul Sinha at High Tech Campus Eindhoven, the company is developing custom compute silicon, memory architecture, and data-center systems. Alongside the financing, former ASML president and CEO Peter Wennink joined the board as chairman. Per the AI Market Watch index, EUCLYD matched zero pipeline items in the last 90 days against one in the prior window, among name-matched ingested sources only.

The raise sits where model capability growth meets hard limits on compute, memory bandwidth, power, and capital for AI factories. EUCLYD’s near-term stack centers on craftwerk, which it calls agentic AI silicon, and craftwerk station CWS, described as a low-power exascale AI factory—programmable ASIC compute plus processor-memory co-design and system-level optimization, rather than a pure software layer on commodity GPUs. Samsung’s semiconductor innovation leadership framed the bet as addressing data-center efficiency constraints; an ASML-alumni chair adds European systems credibility in a silicon race still led by U.S. and Asian incumbents.

For builders and investors, the concrete implication is a well-capitalized European full-stack AI hardware and systems challenger aiming at enterprise, government, and hyperscale buyers. The diligence questions are product, not narrative: whether craftwerk and CWS ship differentiated silicon and systems economics versus marketing, and whether Samsung’s co-lead turns into design-win, manufacturing, or go-to-market leverage beyond the check.

#EUCLYD #AIChips #AIInfrastructure #SeriesA #Samsung #ASML

#EUCLYD#Series A#AI chips#Samsung#ASML#Peter Wennink#related:ASML

How This Connects

Based on AI Infra · Player Map

  1. 1d agoCoreWeave Prices $3.7 Billion Convertible Bond to Fund GPU BuildoutCoreWeave
  2. 5d agoEUCLYD closes €200M+ Series A co-led by Samsung; Peter Wennink joins as chairman · THIS ARTICLE
  3. 1w agoPositron AI closes $875M Series C at $5B to tape out LPDDR5X inference ASIC AsimovPositron AI
  4. 1w agoCoreWeave Commits $6 Billion to Lancaster, Pennsylvania Data CenterCoreWeave
  5. 2w agoNVIDIA to Invest $3.5 Billion in MediaTek in Expanded AI Chip PartnershipNVIDIA invests $3.5B in MediaTek
  6. 2w agoNvidia commits $3.5 billion to MediaTek in a strategic bid to keep AI chip buildouts inside its own ecosystem.Nvidia

Related News

More news from Euclyd

Stay updated with the latest news and announcements from Euclyd.

View all Euclyd news

Discover AI Startups

Explore 5,000+ AI companies with VC-grade analysis, funding data, and investment insights.

Explore Dashboard