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PowerLattice

Category: AI Infrastructure

PowerLattice develops power delivery chiplets that integrate directly into processor packages to reduce compute power needs by over 50% for AI accelerators and high-performance computing. PowerLattice was founded in 2023. The company is led by Dr. Peng Zou. Based in Vancouver, Washington, United States. Team size: 20. Total funding raised: $31M. Latest round: Series A, $25M, November 2025, led by Playground Global and Celesta Capital. Key investors include ["Playground Global","Celesta Capital","Pat Gelsinger (former Intel CEO)"].

Founded
2023
Headquarters
Vancouver, Washington, United States
Team size
20
Total funding
$31M

Value proposition

Reduces energy consumption by 50%+ while improving performance through direct power delivery inside processor packages, addressing the 'AI power wall' challenge by making power delivery as programmable and scalable as compute

Products and solutions

["Power delivery chiplets for AI accelerators","Integrated voltage regulator solutions for data centers","Programmable power management solutions"]

Unique value

Industry's first power delivery chiplet that colocates power delivery with compute units inside the processor package, eliminating traditional power delivery networks (PDNs) and using proprietary miniaturized magnetic inductors integrated on-die

Target customer

AI chipmakers, hyperscale data centers, and high-performance compute processor manufacturers

Industries served

["AI infrastructure","Data centers","High-performance computing","Semiconductor manufacturing"]

Technology advantage

Patented architecture enables 50%+ energy savings, higher performance, and reduced thermal management costs by optimizing power delivery at the chip level. Advanced voltage control circuits and vertical design optimize current paths and reduce losses

How they differentiate

PowerLattice differentiates through its patented power delivery chiplet technology that integrates voltage regulation directly into the processor package, reducing AI compute power consumption by 50%+ compared to traditional motherboard VRM solutions

Main competitors

["NVIDIA","AMD","Intel","Traditional power delivery network (PDN) solutions"]

Key partnerships

["TSMC for chiplet manufacturing","Playground Global (investor and board member)","Celesta Capital (investor)","Pat Gelsinger (strategic investor and board member)"]

Notable customers

["N/A (currently sampling to customers)"]

Major milestones

["Developed industry-first power delivery chiplet reducing compute power needs by >50%","Raised $25M Series A in November 2025","Secured strategic investment and board seat from former Intel CEO Pat Gelsinger","Built a team of ~20 veteran engineers from Qualcomm, NUVIA, and Intel","Working silicon available and sampling to customers"]

Growth metrics

N/A (private company)

Market positioning

Positioned as an innovator targeting the AI infrastructure power crisis, focusing on high-efficiency, low-power AI acceleration for data centers with breakthrough chiplet technology

Geographic focus

North America (headquartered in Vancouver, Washington) with global expansion potential into major AI markets like Asia-Pacific and Europe

Patents and IP

Portfolio of at least 15 issued and pending patents primarily related to chiplet integration, power delivery optimization, and integrated voltage regulator technologies

About Dr. Peng Zou

Veteran electrical engineer with decades of experience in power delivery systems, previously at Qualcomm, NUVIA, and Intel. Expert in semiconductor power management and chiplet technology. Holds at least 15 U.S. patents in integrated voltage regulator technologies.

Official website: