How much funding has SK Hynix raised?

SK Hynix has raised $26.5B in total funding. Their latest funding round was IPO. Key investors include SK Group (parent conglomerate), Public shareholders (KRX: 000660, Nasdaq: SKHY).

Where is SK Hynix headquartered?

SK Hynix is headquartered in Icheon, Gyeonggi-do, South Korea.

What does SK Hynix do?

SK Hynix operates in the AI Chips / Semiconductors sector. South Korean semiconductor giant and the world's leading manufacturer of High Bandwidth Memory (HBM) for AI GPUs, producing DRAM and NAND flash memory chips. World's leading supplier of HBM memory critical for AI GPU accelerators, with first-mover advantage in HBM3E and HBM4 mass production, enabling NVIDIA's AI infrastructure buildout

When was SK Hynix founded?

SK Hynix was founded in 1983. It is based in Icheon, Gyeonggi-do, South Korea.

Who is the CEO of SK Hynix?

Kwak Noh-Jung is the CEO of SK Hynix. The company was founded in 1983.

Where is SK Hynix located?

SK Hynix is headquartered in Icheon, Gyeonggi-do, South Korea.

What funding stage is SK Hynix at?

SK Hynix is currently at the Public stage.

SK Hynix

Category: AI Chips / Semiconductors

South Korean semiconductor giant and the world's leading manufacturer of High Bandwidth Memory (HBM) for AI GPUs, producing DRAM and NAND flash memory chips. SK Hynix was founded in 1983. The company is led by Kwak Noh-Jung. Based in Icheon, Gyeonggi-do, South Korea. Total funding raised: $26.5B. Latest round: IPO. Key investors include SK Group (parent conglomerate), Public shareholders (KRX: 000660, Nasdaq: SKHY).

Founded: 1983
Headquarters: Icheon, Gyeonggi-do, South Korea
Total funding: $26.5B

Value proposition

World's leading supplier of HBM memory critical for AI GPU accelerators, with first-mover advantage in HBM3E and HBM4 mass production, enabling NVIDIA's AI infrastructure buildout

Products and solutions

HBM (High Bandwidth Memory) including HBM3E and HBM4, DRAM (DDR5, LPDDR5X, LPDDR6), NAND Flash (4D NAND up to 321-layer), eSSD (enterprise SSDs), CXL (Compute Express Link) memory, PIM (Processing-in-Memory), SOCAMM2, Custom HBM, AI-DRAM, AI-NAND

Unique value

Dominant ~53-62% market share in HBM (the essential memory for AI GPUs), exclusive multi-year supply agreements with NVIDIA through 2030, and the only memory maker with first-to-market position across multiple HBM generations

Target customer

AI hyperscalers (NVIDIA, Microsoft, Google, AWS, Apple), PC/notebook OEMs (Dell, HP, Asus, MSI), smartphone manufacturers (Apple, Samsung), enterprise data centers, cloud service providers

Industries served

AI/Deep Learning, Cloud Computing, Data Centers, Consumer Electronics, Automotive, Mobile, PC/Notebook, Enterprise Storage

Technology advantage

Industry-leading HBM stacking technology (12-layer, 16-layer HBM4 with 48GB); first to mass-produce DDR5 DRAM; 321-layer 4D NAND; 100+ HBM4-related patent filings (2023-2024); wafer-to-wafer hybrid bonding for 300+ layer NAND; advanced EUV lithography for DRAM scaling

How they differentiate

First to mass-produce HBM3E and HBM4; holds ~53-62% HBM market share vs Samsung (~35%) and Micron (~21%); exclusive multi-year HBM4 supply deal with NVIDIA for Vera Rubin platform; vertically integrated with SK Group (parent conglomerate); world's first 12-layer HBM mass production; 321-layer 4D NAND technology leader

Main competitors

Samsung Electronics (DRAM/NAND/HBM), Micron Technology (DRAM/NAND/HBM)

Key partnerships

NVIDIA (multi-year HBM4 co-development and supply agreement through 2030 for Vera Rubin AI systems), Microsoft (HBM3E for Maia 200 AI chip, DRAM/NAND supply), Google (HBM supply, CXL/PIM memory testing), AWS (HBM supply, next-gen AI memory), Naver Cloud (CXL, PIM memory tech testing), Apple (DRAM/NAND supplier)

Notable customers

NVIDIA, Microsoft, Apple, Amazon AWS, Google, Dell, HP Inc., Hewlett Packard Enterprise, Asus, MSI

Major milestones

1983: Founded as Hyundai Electronics, 1998: Acquired LG Semicon, 2001: Renamed Hynix, 2012: Acquired by SK Group, renamed SK Hynix, 2018: World's first DDR5 DRAM, 2024: World's first mass production of 12-layer HBM3E, 2025: 321-layer 4D NAND mass production, 2026: $26.5B US IPO on Nasdaq (largest foreign IPO in US history), 2026: $1+ trillion market cap, 2026: Multi-year HBM4 deal with NVIDIA for Vera Rubin

Growth metrics

Revenue: ₩97.15 trillion (~$68B) in 2025 (record); Market cap: $1.052 trillion (July 2026); Employees: ~31,704 (2025); HBM market share: ~53-62% (2025-2026); Stock up ~260-280% in 2026

Market positioning

One of the "Big Three" global memory manufacturers alongside Samsung Electronics and Micron Technology; dominant leader in HBM for AI; $1+ trillion market cap (as of 2026); 16th most valuable company globally; listed on KRX (000660) and Nasdaq (SKHY)

Geographic focus

Global (headquarters in South Korea; operations in US, China, Japan; US IPO on Nasdaq in July 2026)

Patents and IP

100+ HBM4-related patent filings (2023-2024); extensive global patent portfolio in DRAM, NAND, HBM, 3D stacking, and advanced packaging across Korea, US, China, Japan, and Europe

About Kwak Noh-Jung

Ph.D. in Materials Engineering, Korea University; Joined Hyundai Electronics (predecessor of SK Hynix) in 1994; EVP & Head of Manufacturing Technology (2019-2021); President & Chief Safety, Product & Production Officer (2021-2022); President & CEO since March 2022; 13th Chairman of Korea Semiconductor Industry Association (2022-2024); Fellow of The National Academy of Engineering of Korea

Official website: https://www.skhynix.com