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ZutaCore

Category: AI Infrastructure

ZutaCore is a leader in waterless, direct-to-chip, two-phase liquid cooling solutions for AI and high-performance computing data centers. ZutaCore was founded in 2016. The company is led by Erez Freibach. Based in San Jose, California, United States. Team size: 101-500. Total funding raised: $200M. Latest round: Series C. Key investors include Mitsubishi Electric, Carrier Ventures, Samsung Ventures, Mitsubishi Heavy Industries, Daikin, Wiwynn, ZIM Ventures, LIP Ventures, European Union (grant).

Founded
2016
Headquarters
San Jose, California, United States
Team size
101-500
Total funding
$200M

Value proposition

Waterless direct-to-chip liquid cooling that eliminates water use, reduces energy consumption by up to 82%, and enables higher compute density for AI and HPC workloads.

Products and solutions

HyperCool (waterless two-phase direct-to-chip liquid cooling), OmniTherm cold plate (for NVIDIA RTX PRO 6000 Blackwell), Waterless End-of-Row CDU family (1.2MW and 2MW), HyperCool Cloud (real-time monitoring platform)

Unique value

Patented waterless two-phase direct-to-chip cooling using a dielectric fluid that boils and condenses in a sealed closed-loop system — no water, no corrosion risk, 82% less energy, supports processors exceeding 4,000W, works in any climate

Target customer

Hyperscalers, neoclouds, data center operators, financial services firms, AI factories, and enterprise compute environments

Industries served

AI Infrastructure, Data Centers, High-Performance Computing, Financial Services, Cloud Computing

Technology advantage

Patented HyperCool two-phase technology using dielectric fluid (non-conductive, non-flammable) that removes heat directly at the processor via boiling/condensation cycle; sealed closed-loop system eliminates water dependency; supports next-gen chips >4,000W; 75+ global deployments; 2MW emulation platform for validation

How they differentiate

Only waterless two-phase direct-to-chip cooling using dielectric fluid (no water, no corrosion, no condensation risk); sealed closed-loop system; supports extreme power densities >4,000W per chip; reduces energy by up to 82%; works in any climate/geography

Main competitors

Accelsius (Nokia Bell Labs spin-off, two-phase cooling), CoolIT Systems (single-phase DLC), Motivair (liquid cooling)

Key partnerships

Mitsubishi Electric, Carrier (QuantumLeap integration), Samsung Electronics/Samsung Ventures, Mitsubishi Heavy Industries (white-label agreement), Wiwynn, SoftBank Corp., Foxconn, NVIDIA, Intel, Equinix, Daikin, ZIM Ventures

Notable customers

Equinix, Texas Advanced Computing Center (TACC), University of Münster, Oregon State University, University of Pisa, NeevCloud, Iozera

Major milestones

2016: Founded by Erez Freibach, 2023: Strategic alliance & investment from Mitsubishi Heavy Industries, 2024: Wiwynn strategic investment & partnership, 2025: Carrier Ventures investment, SoftBank/Foxconn collaboration for NVIDIA H200 rack-integrated solution, ZIM investment, 2026: $100M Series C led by Mitsubishi Electric, Carrier Ventures, Samsung Ventures, OmniTherm cold plate for NVIDIA RTX PRO 6000 Blackwell, 2MW End-of-Row CDU launch

Growth metrics

$42.8M revenue (2025); 75+ deployments worldwide; ~140 employees globally (~100 in Israel); valuation ~$600M (2026, per Calcalist estimate)

Market positioning

Leading pure-play waterless two-phase direct-to-chip liquid cooling company for AI/HPC data centers; positioned at the intersection of the AI infrastructure boom and data center sustainability megatrend

Geographic focus

Global — HQ in San Jose, CA (US); R&D and manufacturing in Sderot, Israel; offices in Europe, Taiwan, India

Patents and IP

Patented HyperCool two-phase direct-to-chip liquid cooling technology; OmniTherm cold plate for PCIe GPUs

About Erez Freibach

Ex-CFO at Clarizen, OzVision, Anamorphose Ltd; also held roles at Carrar

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