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Submer

Category: AI Infrastructure

Submer designs and manufactures immersion cooling and modular liquid-cooled infrastructure for AI-ready, hyperscale, and high-density datacenters. Submer was founded in 2015. The company is led by Patrick Smets. Based in Barcelona, Spain. Team size: 101-500. Total funding raised: $131M. Latest round: Debt. Key investors include M&G Investments (Catalyst), Planet First Partners, Norrsken VC, Mundi Ventures, Accel, Big Sur Ventures, Matterscale Ventures, Santander (debt).

Founded
2015
Headquarters
Barcelona, Spain
Team size
101-500
Total funding
$131M

Value proposition

Sustainable, waterless immersion cooling technology that lets datacenters handle rising AI chip thermal design power while cutting energy, water, and carbon footprint.

Products and solutions

SmartPod EVO and SmartPod EXO immersion cooling tanks, Submer Labs R&D, Rubix (design & build / DC development & operations), InferX (GPUaaS/AIaaS / NVIDIA Cloud Partner), Radian Arc (sovereign telco/edge GPU IaaS, acquired 2026), Submer AI Cloud

Unique value

Full-stack immersion cooling + modular datacenter design/build + GPU-as-a-service, positioning Submer as an end-to-end AI-ready datacenter infrastructure partner rather than a point cooling-hardware vendor.

Target customer

Hyperscalers, colocation providers, HPC operators, enterprises and government/sovereign compute buyers building AI-ready data centers.

Industries served

Data center infrastructure, AI/HPC compute, cloud & hyperscale, blockchain, edge computing.

Technology advantage

Proprietary dielectric immersion cooling fluid tech, 500MW+ deployed liquid-cooled capacity, decade of field-proven thermal engineering, manufacturing (Gigafactory) in Houston plus R&D labs in Barcelona and Taipei.

How they differentiate

Combines immersion cooling hardware manufacturing with full datacenter design-build and GPU-as-a-service offerings, and has scaled deployments to 500MW+ with global manufacturing footprint (Spain, US, Taiwan), unlike pure-play cooling hardware competitors.

Main competitors

LiquidStack, Green Revolution Cooling (GRC), Asperitas, Iceotope

Key partnerships

Anant Raj Ltd (India AI-ready datacenter JV/MoU, 2026), Netceed (EMEA distribution partnership for full-stack AI infrastructure, Jul 2026), Barclays Bank Ireland (Series C placement agent), Santander (growth debt financing), Castrol (immersion cooling POC, Italy), Radian Arc (acquired Feb 2026; telco/edge GPU cloud)

Notable customers

Unnamed major hyperscaler, Telefónica, ExxonMobil, European Commission, major HPC/research centers

Major milestones

2015 founded, 2018 SmartPod launch, 2019 US expansion (Houston HQ + Sausalito R&D), 2021 Submer Labs launch, 2023 Taipei R&D lab, Jan 2024 Patrick Smets becomes CEO, 2024 SmartPod EXO + $55.5M Series C + ~$21M Santander debt, 2025 surpassed 500MW deployed; Submer AI Cloud + Design & Build (Rubix); InferX spinout, Feb 2026 acquired Radian Arc (telco/edge GPU cloud), Feb 2026 India JV/MoU with Anant Raj, Jul 2026 €1B+ AI datacenter announced at Flix, Catalonia, Jul 2026 Netceed EMEA distribution partnership

Growth metrics

Surpassed 500MW in cumulative liquid-cooled deployments as of 2025; ~600 GWh electricity savings, ~40% lower CO2 emissions, 3.48 billion liters water saved (company-reported cumulative impact metrics).

Market positioning

Positioned as a full-stack, sustainability-focused AI infrastructure company (thermal + modular DC build + GPU services) rather than a single-product cooling vendor.

Geographic focus

Global — strong presence in Europe (HQ Spain), North America (Houston Gigafactory/HQ), APAC (Taiwan), and expanding into India and MEA (Saudi Arabia office).

Patents and IP

US11856727B2 (Cooling system for computer components, granted Dec 2023, assignee Submer Technologies S.L.); design patent D989255 (Fluid distribution equipment); additional filings include dielectric nanoparticle coolant fluids, active-passive immersion systems, maintainable liquid immersion cooling (EP filings 2024–2025).

About Patrick Smets

CEO of Submer since Jan 2024 (joined as COO Aug 2023); former McKinsey Associate Partner; B2B Industry 4.0 / IoT / telecom / software scaling executive; 12 years military experience.

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