HexSeed Technology
Category: AI Chips / Semiconductors
UK carbon-capture-to-supermaterials startup developing low-temperature diamond coatings for GaN power devices to reduce heat loss in AI data centre power conversion hardware. HexSeed Technology was founded in 2025. The company is led by Mark Tandy. Based in Banchory, near Aberdeen, Scotland, UK. Team size: 1-10. Total funding raised: $811K. Latest round: Seed. Key investors include Carbon13, Net Zero Technology Centre, Vento Ventures, Innovate UK (Partnership Grant).
- Founded
- 2025
- Headquarters
- Banchory, near Aberdeen, Scotland, UK
- Team size
- 1-10
- Total funding
- $811K
Value proposition
Transforms captured CO₂ into high-value supermaterials (low-carbon lab-grown industrial diamonds) and applies ultra-thin diamond coatings to gallium nitride (GaN) power devices, pulling heat away from active regions so they run cooler, harder, longer and use less energy — reducing the large share of AI data centre electricity lost as heat in power conversion.
Products and solutions
Low-temperature microwave plasma process that grows diamond coatings directly onto finished GaN power devices, low-carbon lab-grown industrial diamonds from captured CO₂.
Unique value
Diamond is the best-known thermal conductor, but conventional diamond growth requires temperatures that would destroy finished semiconductors. HexSeed's low-carbon, low-temperature process applies diamond coatings directly onto completed GaN devices without damaging them — unlocking GaN's full efficiency potential.
Target customer
Data centre power conversion hardware makers and hyperscale data centre operators; initial target is power conversion hardware for hyperscale data centres.
Industries served
Semiconductors / power electronics, AI data centre infrastructure, energy efficiency / thermal management.
Technology advantage
Low-temperature microwave plasma diamond deposition on finished GaN devices (developed with University of Bristol Professors Paul May and Martin Kuball); carbon capture and utilisation (CCU) route to low-carbon diamond supermaterials.
How they differentiate
Unlike competitors growing GaN on diamond substrates or using SiC, HexSeed applies diamond coatings directly onto already-finished GaN devices via a low-temperature process, avoiding thermal damage and using a low-carbon CCU-derived diamond source.
Main competitors
Akash Systems (GaN-on-diamond), Diamond Semiconductor (diamondsemicon.com), SweGaN (Swedish GaN-on-SiC epitaxial wafers).
Key partnerships
University of Bristol (Prof Paul May, diamond materials; Prof Martin Kuball, semiconductor heat management), Carbon13 (climate-tech venture builder / lead investor), Net Zero Technology Centre (TechX Accelerator), Innovate UK (Partnership Grant)
Major milestones
Founded late 2025, incorporated 27 Nov 2025 (Companies House SC871246), raised £600k seed round led by Carbon13 (Aug 2026), awarded provisional Innovate UK Partnership Grant, participating in Net Zero Technology Centre TechX Accelerator.
Market positioning
Early-stage (seed) research-led hardware startup in the emerging GaN-on-diamond / diamond thermal-management space, targeting AI data centre power efficiency as its first market.
Geographic focus
UK (Scotland) with global data centre market focus.
About Mark Tandy
Ex-TotalEnergies Senior Project Developer; Oxford MBA. Previously involved with Carbon13 and Carbon Management Society.
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Official website: https://hexseedtechnology.com/
