nanoSkunkWorkX (nSWX)
Category: AI Chips / Semiconductors
Malaysian deep-tech startup turning bulk graphene into manufacturable interface devices (nSDs) for AI chip packaging, green hydrogen, and diagnostics. nanoSkunkWorkX (nSWX) was founded in 2019. The company is led by Iqbal Shamsul. Based in Petaling Jaya, Selangor (Kuala Lumpur), Malaysia. Team size: 1-10. Total funding raised: $3.11M. Latest round: Seed. Key investors include Tin Men Capital, Gobi Partners (Gobi Dana Impak Ventures Fund), Khazanah Nasional Berhad Dana Impak, Kumpulan Modal Perdana.
- Founded
- 2019
- Headquarters
- Petaling Jaya, Selangor (Kuala Lumpur), Malaysia
- Team size
- 1-10
- Total funding
- $3.11M
Value proposition
nSWX embeds proprietary nanostructured Scalable Devices (nSDs) at interface bottlenecks to control heat, charge, energy, and signal flow — improving thermal and electrical performance of AI chip packaging (copper interconnects, interposers, RDLs) without replacing partner technology.
Products and solutions
nSD-I (lead semiconductor product for copper interconnects in AI chip packaging, reducing heat while carrying more current), graphene-enhanced electrodes for hydrogen electrolysis, ruggedised field-deployable biosensors (SUSANNE infra-light nanofabrication platform).
Unique value
Proprietary wet electrochemistry and sustainable deposition platform that integrates commodity graphene into functional devices at low cost and high energy efficiency — enabling system-level gains without wafer-fab dependency or cost-/emissions-intensive synthesis routes.
Target customer
Semiconductor/advanced packaging partners (OEMs, foundries, integrators), green hydrogen electrolyser makers, and diagnostics/health partners (including Malaysia's Ministry of Health and Universiti Malaya TIDREC).
Industries served
Semiconductors / AI chip advanced packaging, green hydrogen / clean energy, diagnostics / bioelectronics.
Technology advantage
Electrochemical deposition platform (SUSANNE) that turns raw bulk graphene into manufacturable interface devices; bridges materials science and device engineering; built on NASA-derived insights (Dr. Salim) and MIT/Morgan Stanley engineering-commercial discipline (Shamsul).
How they differentiate
Focuses on interface-level graphene devices that work with existing partner systems rather than replacing them, using low-cost electrochemical deposition instead of wafer-fab-dependent synthesis; spans chips, hydrogen, and diagnostics from one platform.
Main competitors
Advanced packaging materials/interconnect startups and graphene materials companies targeting chip thermal management, established advanced packaging material suppliers (copper interconnect and interposer material vendors).
Key partnerships
Gobi Partners (Gobi Dana Impak Ventures Fund), Khazanah Nasional Berhad Dana Impak, Kumpulan Modal Perdana (KMP), Tin Men Capital, Malaysia's Ministry of Health, Universiti Malaya TIDREC, US Navy Naval Medical Research Unit Indo Pacific (NAMRU-IP) — paid joint R&D biosensors, MTDC & Silicon Catalyst UK (SemiconStart Malaysia cohort), Epoch Foundation / Startup Island Taiwan (Garage+ program)
Notable customers
Malaysia's Ministry of Health, Universiti Malaya Tropical Infectious Diseases Research & Education Centre (TIDREC) — biosensor platform partnership, US Navy Naval Medical Research Unit Indo Pacific (NAMRU-IP) — paid biosensor joint R&D agreement
Major milestones
Founded 2019, Grand Champion TECH Planter Malaysia 2025, invited to 2024 Hilton Head Workshop, presented at IEEE EPEPS 2025 (San Jose), selected for Garage+ Startup Global Program (F25, 2025), selected for inaugural SemiconStart Malaysia cohort (MTDC & Silicon Catalyst UK, 2026), raised $2M seed led by Tin Men Capital (Sept 2026).
Growth metrics
Generated first revenue with less than US$1.5M in total capital; developed core platform and three product lines.
Market positioning
Emerging Malaysian deep-tech leader in advanced materials; Grand Champion of TECH Planter Malaysia 2025; invited to present at IEEE EPEPS 2025 and 2024 Hilton Head Workshop; selected for SemiconStart Malaysia and Garage+ Startup Global Program.
Geographic focus
Malaysia (HQ, ~13% of global semiconductor assembly/testing/packaging) and Southeast Asia; engaging global energy leaders for hydrogen co-development.
Patents and IP
WO2022158961A1 (PCT/MY2021/050115) — A method for nanocomposite deposition; assignee Nanoskunkworkx Sdn Bhd; inventors include Wan Wardatul Amani Binti Wan Salim; priority 2021-01-19; published 2022-07-28; legal status Ceased.
About Iqbal Shamsul
Ex-Morgan Stanley Vice President (energy and derivatives trader); MIT-trained computer scientist. Co-founder and CEO of nanoSkunkWorkX.
Latest news about nanoSkunkWorkX (nSWX)
More AI Chips / Semiconductors companies
Official website: https://nanoskunkworkx.com/
