ULVAC, Inc.
Category: AI Chips / Semiconductors
Japanese manufacturer of vacuum-based semiconductor, display, and industrial production equipment, including advanced packaging equipment for AI chip manufacturing. ULVAC, Inc. was founded in 1952. The company is led by Junya Kiyota. Based in Chigasaki, Kanagawa, Japan. Team size: 500+. Latest round: Post-IPO.
- Founded
- 1952
- Headquarters
- Chigasaki, Kanagawa, Japan
- Team size
- 500+
Value proposition
Provides vacuum equipment, components, and materials enabling advanced semiconductor and display manufacturing processes, including next-generation packaging for AI chips.
Products and solutions
Semiconductor and electronic device production equipment (including advanced packaging systems like the NA-1500 plasma ashing system for large rectangular substrates), display and energy-related production equipment, industrial equipment components, vacuum materials, surface analysis and coating systems.
Unique value
Deep, decades-long expertise in vacuum technology applied across the full semiconductor and display manufacturing value chain, including cutting-edge advanced packaging for AI/HPC chips on large rectangular substrates.
Target customer
Semiconductor foundries, chipmakers, display manufacturers, and industrial/research institutions requiring vacuum technology.
Industries served
Semiconductors, displays, electronics, automotive, chemical, food, pharmaceutical, and research/university sectors.
Technology advantage
70+ years of proprietary vacuum technology R&D; strong position in advanced packaging equipment (e.g. fan-out panel-level packaging, large rectangular substrate processing) needed for AI chip scaling, targeting production by 2028.
How they differentiate
Specializes specifically in vacuum-based process equipment (deposition, etching, ashing) with deep expertise in advanced packaging for AI/HPC chip scaling on large rectangular substrates, differentiated from broader-line competitors like Applied Materials and Tokyo Electron.
Main competitors
Tokyo Electron, Applied Materials, Lam Research, KLA Corporation
Key partnerships
Joint research with Osaka University (ULVAC-Osaka University Joint Research Laboratory for Future Technology) and Institute of Science Tokyo, equipment supply relationships across major semiconductor foundries and manufacturers globally, distribution/service partnership with Knights Engineering (Malaysia).
Notable customers
Major global semiconductor foundries and chipmakers (customer-specific names not publicly disclosed in available sources).
Major milestones
Founded 1952, listed on Tokyo Stock Exchange 1968, joined 1st Section 2004, moved to TSE Prime Market following 2022 restructuring, leadership transition July 2026 (Iwashita to Chairman, Kiyota to President/CEO), ongoing development of advanced packaging equipment for large rectangular substrates targeting AI semiconductor production lines by 2028.
Growth metrics
Market cap approximately ¥374.78B (~$2.5B) as of recent trading; consolidated employees 5,613 as of June 2026; 14,777 shareholders; principal institutional shareholders include Master Trust Bank of Japan, Nippon Life Insurance, State Street, JPMorgan, Goldman Sachs Asset Management; listed on TSE Prime Market since 2004 (originally listed 1968).
Market positioning
One of the top 5 semiconductor manufacturing equipment suppliers in Japan; established global player in vacuum technology equipment for chip and display fabrication.
Geographic focus
Global — Japan, US, Europe, China, Korea, Southeast Asia (competes primarily against US and Japanese semicap equipment majors).
Patents and IP
Maintains active intellectual property portfolio in vacuum technology; details published via ULVAC's Technical Journal / Intellectual Property pages.
About Junya Kiyota
Long-time ULVAC executive; appointed President, Executive Officer (社長執行役員) effective July 1, 2026, succeeding Setsuo Iwashita (who moved to Chairman). Oversees group technology and innovation strategy.
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Official website: https://www.ulvac.co.jp/en/