VeriSilicon
Category: AI Chips / Semiconductors
China's leading Silicon Platform-as-a-Service (SiPaaS) company providing custom silicon design and semiconductor IP licensing, listed on Shanghai STAR Market. VeriSilicon was founded in 2001. The company is led by Dr. Wayne Wei-Ming Dai. Based in Shanghai, China. Team size: 500+. Total funding raised: $92.3M. Latest round: Post-IPO. Key investors include National Integrated Circuit Industry Investment Fund, Xiaomi, IDG Capital, Intel Capital, Samsung Ventures, Walden International, VantagePoint, SunIC Capital, WestSummit Capital, Juntong Capital.
- Founded
- 2001
- Headquarters
- Shanghai, China
- Team size
- 500+
- Total funding
- $92.3M
Value proposition
One-stop, platform-based custom silicon (SoC) design and mass-production services plus a broad in-house semiconductor IP portfolio (GPU, DSP, video codec, vision, ISP), enabling customers to shorten chip design cycles and reduce risk across advanced process nodes.
Products and solutions
Custom Silicon Platform (chip design + mass production / turnkey), SiPaaS, Six in-house processor IP families: Vivante GPU, NPU, Hantro VPU, ZSP DSP, ISP, Display Processing, 1700+ analog/mixed-signal/RF/interface IPs, Chiplet solutions (IP-as-Chiplet) for AIGC and smart mobility, Automotive-grade / FuSa SoC platforms.
Unique value
China's #1 and world's top-7 silicon IP licensor (IPnest 2019) with a unique SiPaaS model combining in-house IP with one-stop custom silicon design and mass production, spanning advanced nodes (7nm FinFET, 22nm FD-SOI, 5nm R&D).
Target customer
Fabless semiconductor companies, OEMs, and system companies in mobile internet, datacenters/cloud AI, IoT, automotive, industrial, and medical electronics.
Industries served
Semiconductors / IC design, AI computing & datacenter, automotive, IoT, smart home/city, mobile internet, industrial, medical electronics.
Technology advantage
Broad in-house processor IP portfolio (GPU, DSP, video, vision, ISP) integrated into a platform-based custom silicon service; advanced process-node tapeout experience (7nm/10nm/14nm FinFET, FD-SOI); growing Chiplet and AIGC platform capabilities.
How they differentiate
Combines a broad in-house processor IP portfolio with one-stop custom silicon design and mass-production services (SiPaaS) — a vertically integrated model most pure IP vendors or pure design houses lack; strong China domestic positioning with national fund backing.
Main competitors
Arm, Synopsys, Cadence, Imagination Technologies (IP licensing), Brite Semiconductor, eSilicon (chip design services), Montage Technology (China semiconductor).
Key partnerships
National Integrated Circuit Industry Investment Fund (Big Fund), Xiaomi Changjiang Industrial Fund, Samsung Venture Investment, Intel Capital, IDG Capital, Walden International, VantagePoint, SunIC Capital, WestSummit Capital.
Notable customers
Cloud-side AI ASIC and IP customers (AI compute chip design demand), automotive, IoT, and mobile customers across China and globally.
Major milestones
Founded 2001, acquired ZSP DSP division from LSI Logic (2006), merged with Vivante (GPU IP), IPO on Shanghai STAR Market (688521.SH) Aug 18, 2020 raising ~RMB1.86B, ranked China #1 / world #7 silicon IP vendor (IPnest 2019), 2025 private placement completed (~RMB1.807B) for Chiplet & AIGC (plan announced Dec 2023), Filed Hong Kong Main Board IPO application April 2026, H1 2026 record revenue RMB1.864B on AI demand.
Growth metrics
H1 2026 revenue RMB1.864B (US$276M), +91.37% YoY; AI-computing-related orders ~90% of new backlog; Q1 2026 new orders surged to RMB8.24B; TTM revenue ~$507M (PitchBook).
Market positioning
China's #1 silicon IP licensor and world's 7th largest (IPnest 2019); a leading China-based custom silicon/ASIC design service provider riding the domestic AI compute chip demand wave.
Geographic focus
China (primary) with global operations — 9 design/R&D centers in China and US, 10 sales offices worldwide; ~half of business historically outside China.
Patents and IP
1700+ analog/mixed-signal/RF/interface IPs; 6 in-house processor IP families (GPU, NPU, VPU, DSP, ISP, Display); advanced nodes incl. 4nm/5nm/7nm; 30%+ annual R&D/revenue ratio.
About Dr. Wayne Wei-Ming Dai
Ex-Co-Chairman & CTO of Celestry Technologies (EDA, acquired by Cadence 2002); Founder/Chairman/CEO of Ultima Interconnect Technology; Professor of Computer Engineering, UC Santa Cruz; PhD EE & BS Computer Science, UC Berkeley. NSF Presidential Young Investigator Award (1990); Ernst & Young Entrepreneur of the Year China (2007).
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Official website: https://www.verisilicon.com
