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Hexapro

Category: AI Chips / Semiconductors

Korean nano-materials company developing large-area AAO (Anodized Aluminum Oxide) membranes for 3D silicon capacitors targeting AI accelerators, HBM, and high-capacity semiconductor applications Hexapro was founded in 2022. The company is led by Kim Taesun. Based in Ansan-si, Gyeonggi-do, South Korea. Team size: 1-10. Total funding raised: $1.6M. Latest round: Series A. Key investors include LF Investment, TIPS (Tech Incubator Program for Startups).

Founded
2022
Headquarters
Ansan-si, Gyeonggi-do, South Korea
Team size
1-10
Total funding
$1.6M

Value proposition

Proprietary AAO membrane technology that enables 3D silicon capacitors with 1,000x surface area expansion vs. planar structures, reducing MLCC count from 10-20 to 1, at less than 1/3 the conventional cost through reusable aluminum substrate technology

Products and solutions

AAO Membrane, AAO Powder, AAO Polymer Composite Film, V Shape AAO on Al, 3D Silicon Capacitor solutions using through-hole AAO for trench MIM capacitors

Unique value

World's first 8-inch large-area through-hole AAO membrane with reusable substrate technology, cutting supply cost to under 1/3 of conventional methods while enabling ultra-high-capacity 3D capacitors for AI chips

Target customer

Semiconductor manufacturers (AI accelerator chipmakers, HBM producers); capacitor/MLCC manufacturers; electric vehicle battery component makers; optical and filter material companies

Industries served

Semiconductor, AI Hardware, Electric Vehicles, Optical Materials, Nanobio Materials, Filter & Sensor Materials

Technology advantage

Proprietary AAO separation technology that peels AAO layer from aluminum substrate allowing substrate reuse (50-100 sheets per piece vs. 1); first to achieve 8-inch large-area through-hole AAO; 1,000x surface area expansion for 3D capacitors; cost reduction to under 1/3 of conventional methods; 9 patents; selected for 9.0 billion won MSIT nanoscale materials R&D project

How they differentiate

Unlike conventional AAO manufacturing that requires melt-away process (single-use, expensive), Hexapro's separation technology enables substrate reuse and large-area production. Their AAO-based 3D silicon capacitors can replace 10-20 MLCCs with a single component, challenging market leaders like Murata with more economical and efficient materials.

Main competitors

Murata Manufacturing (Japan), TDK Corporation (Japan), Samsung Electro-Mechanics (South Korea)

Key partnerships

Sungkyunkwan University, Seoul National University, KIST (Korea Institute of Science and Technology) — joint 9.0 billion won MSIT nanoscale materials R&D project, ETRI (Korea Electronics and Telecommunications Research Institute) — technology transfer, Korea Electronics Technology Institute, Hanyang University ERICA, Kyonggi University

Notable customers

Conducting PoC (Proof of Concept) tests with domestic South Korean semiconductor conglomerates (names undisclosed)

Major milestones

2022: Company founded, TIPS selection, Venture certification, R&D center established, 2023: TIPS startup task selection, 2024: ETRI technology transfer, Women-owned business designation, Root technology certification, 2025: LF Investment seed funding, Selected for 9.0 billion won MSIT nanoscale materials R&D project (with SKKU, SNU, KIST)

Growth metrics

Cumulative R&D spending: 2.2 billion won (~$1.7M); Targeting annual sales capacity of 10 billion won (~$7.7M) with new production line by H1 2026

Market positioning

Early-stage deep-tech materials company positioned to disrupt the MLCC and silicon capacitor market for AI hardware, competing against established Japanese (Murata, TDK) and Korean (Samsung Electro-Mechanics) players with a fundamentally different AAO-based approach

Geographic focus

South Korea (domestic semiconductor conglomerates PoC); Japan (Murata comparison); Global AI chip market

Patents and IP

9 patents (as of 2026); 3 registered trademarks

About Kim Taesun

Ex-Samsung SDI Legal Team; Ex-Korean Intellectual Property Office (KIPO) Trial Examiner (Grade 4 Senior Technical Officer); Patent Attorney since 2003; M.S. Chemical Engineering, Seoul National University

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