Huixi Technology (Huixi Intelligence)
Category: AI Chips / Semiconductors
Beijing-based developer of high-performance AI SoCs and full-stack computing platforms for embodied AI robots, L4 autonomous logistics and assisted driving. Huixi Technology (Huixi Intelligence) was founded in 2022. The company is led by Ningyi Xu (徐宁仪). Based in Beijing (Yizhuang), China. Team size: 101-500. Total funding raised: $400.0M. Latest round: Series B. Key investors include Beijing AI Industry Investment Fund, National AI Industry Investment Fund, Beijing Robotics Industry Development Investment Fund, Xiaomi, Shunwei Capital, AgiBot, Yinshan Capital, Oriental Harmony (正心谷资本), Golden Pine (金浦投资), SenseTime Guoxiang Capital, Cathay Capital (凯辉基金), Yuansheng Capital.
- Founded
- 2022
- Headquarters
- Beijing (Yizhuang), China
- Team size
- 101-500
- Total funding
- $400.0M
Value proposition
Gives robot makers chips that are ready for mass production (Guangzhi R1 series), plus modules and a full software stack. The stack covers the compiler, operator library, runtime, middleware, OS, simulation, real-time control and VLA models. Together these lower the engineering barrier between algorithm development and real-robot deployment.
Products and solutions
Guangzhi R1 MAX SoC (500 TOPS, in mass production), R1 PRO brain-cerebellum fusion SoC (375 TOPS, CPU+NPU+GPU+real-time interfaces), RCM400/RCM500 modules, Huixi Embodied series, RISE computing platform, RPU compute core, RhinoVLA foundation model and development pipeline, Huixi Mobility, Huixi Space and Huixi Edge product lines
Unique value
Follows a 'data closed loop defines the chip' approach. A general programmable architecture fuses perception, reasoning, decision-making and motion control on a single SoC. Mass production is validated on AgiBot G2: 17,625 tasks at 99.99% success over a 6-day production-line livestream.
Target customer
Humanoid and embodied robot OEMs; makers of L4 autonomous logistics, mining and cleaning vehicles; passenger-car ADAS developers
Industries served
Robotics / embodied AI, industrial manufacturing, smart retail, commercial catering, unmanned logistics, mining, automotive ADAS
Technology advantage
The founding team built Baidu's Kunlun cloud AI chip and led NIO's first-generation ADAS into production. The company does full-stack hardware-software co-design. It has an early mass-production design win with AgiBot. It has strong backing from state funds and industrial investors.
How they differentiate
Its chips are designed natively for embodied AI rather than repurposed from automotive chips. A single SoC fuses 'brain' and 'cerebellum' functions, backed by a complete robotics software stack. The chips are already in mass-production delivery to leading humanoid OEMs.
Main competitors
Black Sesame Technologies (SesameX), Axera (爱芯元智), Horizon Robotics, Qualcomm (Dragonwing IQ10)
Key partnerships
AgiBot (智元机器人, strategic investor and customer, G2 robot), SenseTime (investor), Xiaomi (investor), Huixi Embodied Computing Ecosystem Alliance (辉羲具身智算生态联盟), Beijing Yizhuang 机因工场 supply-chain platform
Notable customers
AgiBot (智元机器人, G2 robot)
Major milestones
2022-04: founded. 2023-02: Angel+ round led by Shunwei and Xiaomi. 2024-09: Series A. 2025: R1 chip enters mass production on AgiBot G2. 2026-02: Pre-B round above RMB 800M. 2026-06: AgiBot G2 6-day livestream completes 17,625 tasks at 99.99% success. 2026-08: Huixi Embodied series launched at WRC. 2026-10: Pre-B+ and B rounds, 2026 total above RMB 2.5B.
Growth metrics
2026 YTD equity funding above RMB 2.5B. R1 MAX in mass production with multiple embodied-AI customers. Huixi Embodied shipments growing. 200+ full-stack R&D staff (2023).
Market positioning
Among the leading Chinese suppliers of embodied-AI compute chips; claims top-tier share of the embodied-AI chip market. Aims to become a global leading supplier of embodied-AI computing platforms.
Geographic focus
China (domestic, self-controllable compute), with global ambitions
About Ningyi Xu (徐宁仪)
Ex-Baidu Chief Architect, Intelligent Chip Division, and Chair of Technical Committee (led Kunlun cloud AI chip); Ex-Microsoft Research Asia Hardware Computing Group Lead; Advisor/Chief Scientist, SenseTime Custom Computing; Tenured Professor, Shanghai Jiao Tong University Qingyuan Research Institute; Tsinghua University BS/MS/PhD Electronic Engineering
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Official website: https://www.huixi.tech