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Sensesemi Technologies

Category: AI Chips / Semiconductors

DLI-approved fabless semiconductor startup building ultra-low-power System-on-Chips (SoCs) with embedded AI for edge inferencing in IoT and IoMT applications. Sensesemi Technologies was founded in 2014. The company is led by Vijay Muktamath. Based in Bengaluru, Karnataka, India. Team size: 11-50. Total funding raised: $2.75M. Latest round: Seed. Key investors include Piper Serica, LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, Whitepine Investments, Jain Oncor, REAN Foundation, Niraj Shah, Deepak Khanna.

Founded
2014
Headquarters
Bengaluru, Karnataka, India
Team size
11-50
Total funding
$2.75M

Value proposition

Delivers a highly configurable, ultra-low-power SoC (SenseSoC) combining an efficient MCU, AI accelerator, wireless interface, analog front-end, and built-in security for battery-constrained edge/IoT and medical IoT devices.

Products and solutions

SenseSoC — flagship ultra-low-power SoC with MCU, wireless, AI accelerator, analog front-end, and hardware security, SenseH — portable multi-parameter health monitoring device (cuffless BP, HR, SpO2, temperature, 6-12 lead ECG)

Unique value

Ultra-low-power, highly configurable SoC architecture with embedded AI enabling edge inferencing without cloud dependency — positioned as an India-designed alternative to global chip incumbents.

Target customer

OEMs and device makers building connected IoT and IoMT (Internet of Medical Things) products requiring low-power edge AI inferencing.

Industries served

IoT, IoMT (medical devices), wearables, connected sensors

Technology advantage

Vertically integrated SoC design combining MCU + AI accelerator + wireless + security in a single ultra-low-power chip; recipient of India's Design Linked Incentive (DLI) government scheme.

How they differentiate

Focus on ultra-low-power AIoT SoCs purpose-built for medical/IoT edge inferencing, versus Mindgrove/InCore's broader RISC-V SoC and IP-core focus.

Main competitors

Mindgrove Technologies, InCore Semiconductors, Vervesemi Microelectronics

Key partnerships

Design Linked Incentive (DLI) Scheme, Government of India (Ministry of Electronics & IT), C-DAC, Microsoft, REAN Foundation, Inflection Zone Labs

Major milestones

DLI (Design Linked Incentive) scheme approval by Govt. of India, plans to tape out and validate first two test chips by 2026, ₹25 Cr seed round closed Jan 2026.

Growth metrics

48 employees as of Jun 30, 2026 (Tracxn); annual revenue 0–₹10 Cr as on Mar 31, 2025.

Market positioning

Emerging India-based fabless semiconductor challenger targeting edge-AI silicon, backed by domestic government incentives (DLI) amid India's push for semiconductor self-reliance.

Geographic focus

India, with aspirations toward global edge-AI chip markets

Patents and IP

Indian patent granted: “Method, System and Device for Generating Electrocardiogram with Fewer Number of Probes” (ECG signal acquisition / sensor fusion for edge AI).

About Vijay Muktamath

VP Systems Engineering & PLM at Asarva; semiconductor industry veteran.

Latest news about Sensesemi Technologies

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