Suanmiao Tech
Category: AI Chips / Semiconductors
Chinese 3D AI chip startup developing domestically-produced 3D-stacked inference chips, leveraging technology roots from Ethereum mining hardware. Suanmiao Tech was founded in 2022. The company is led by Wang Fuquan. Based in China. Total funding raised: $140M. Latest round: Pre-Series A. Key investors include Source Code Capital (源码资本), Shixi Capital (石溪资本), Lenovo Capital (联想创投), Xianghe Capital (襄禾资本), CDB Capital (国开金融), Beijing Shunxi Capital (北京顺禧).
- Founded
- 2022
- Headquarters
- China
- Total funding
- $140M
Value proposition
Breaks the memory wall via 3D chip stacking, reducing data transmission distance by two orders of magnitude vs traditional inter-chip interconnects, achieving 16-32TB/s memory bandwidth for AI inference.
Products and solutions
100% domestic 3D-stacked AI inference chips.
Unique value
3D chip stacking architecture derived from prior Ethereum-mining chip expertise, enabling ultra-high memory bandwidth for domestic AI inference chips without relying on foreign HBM/advanced packaging supply chains.
Target customer
Chinese AI compute/data center operators seeking domestically-produced inference chips amid US export controls.
Industries served
AI Infrastructure / Semiconductors
Technology advantage
3D stacking reduces inter-chip data transmission distance by ~100x vs traditional interconnects; achieves 16-32TB/s memory bandwidth, addressing the 'memory wall' bottleneck in AI inference under US chip export restrictions.
How they differentiate
Focuses specifically on 3D die-stacking to solve the memory bandwidth bottleneck for inference workloads, leveraging manufacturing/engineering legacy from Ethereum ASIC mining hardware rather than starting from a traditional GPU-design background like rivals.
Main competitors
Shanghai Orient Computing Core (Dongfang Suanxin/东方算芯, led by Wei Shaojun), Biren Technology, Moore Threads, MetaX
Major milestones
Raised nearly RMB 1 billion (~$140M) combined across Pre-A and Pre-A1 rounds to mass-produce 100% domestic 3D AI inference chips.
Market positioning
Domestic Chinese AI inference chip challenger positioned against both Nvidia (via export-control substitution) and other China GPU/chip challengers (Biren, Moore Threads, MetaX, Dongfang Suanxin).
Geographic focus
China
About Wang Fuquan
PhD, Institute of Acoustics, Chinese Academy of Sciences (State Key Lab), studied under underwater-acoustics physicist academician Zhang Renhe; postdoc at CAS Institute of Computing Technology under Loongson (Godson) chief scientist Hu Weiwu; background in high-throughput array signal processing and computer architecture.
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Official website: https://www.sunmmio.com/
