TYLsemi
Category: AI Chips / Semiconductors
Chiplet-first silicon company building a full-stack chiplet platform for custom AI infrastructure silicon TYLsemi was founded in 2026. The company is led by Mohit Gupta. Based in San Jose, California, United States. Team size: 11-50. Total funding raised: $43M. Latest round: Seed. Key investors include Matter Venture Partners, Viola Ventures, GHOVC (Global Hands-On VC), Egis Technology (Egistec).
- Founded
- 2026
- Headquarters
- San Jose, California, United States
- Team size
- 11-50
- Total funding
- $43M
Value proposition
First pure-play chiplet company delivering a full portfolio across IO, power delivery, and memory paired with chiplet-based custom silicon design, integration and supply-chain ownership — enabling up to 50% faster development and 50% reduced costs for custom AI silicon
Products and solutions
TYL.IO (connectivity chiplet family supporting PCIe, ESUN, UALink with co-packaged optics roadmap), TYL.Power (integrated voltage regulator chiplet for in-package power delivery), TYL.Mem (memory connectivity chiplet, planned), TYL.Forge (end-to-end chiplet-enabled custom silicon platform integrating IP, foundry, packaging, and production readiness)
Unique value
TYLsemi is the first chiplet platform company to deliver a complete portfolio of standards-based, production-ready chiplets (IO, power, memory) with an end-to-end custom silicon platform (TYL.Forge), making custom XPU design accessible beyond just the largest hyperscalers
Target customer
Hyperscalers, cloud providers, AI companies, and emerging AI chip companies building custom XPUs and AI accelerators
Industries served
AI Infrastructure, Semiconductor, Cloud Computing, Data Centers
Technology advantage
Standards-based UCIe chiplet architecture; production-ready chiplets pre-validated for system integration; deep expertise from Alphawave/SiFive/Cadence alumni; TSMC partnership for advanced packaging; full-stack ownership from design through supply chain
How they differentiate
Unlike EDA vendors, IP providers, or design services firms that only provide part of the solution, TYLsemi delivers production-ready, standards-based (UCIe) chiplet silicon with integrated packaging, validation, and supply-chain ownership — a unified delivery model that reduces fragmentation and integration risk for customers
Main competitors
Eliyan (chiplet interconnect technology), Baya Systems (chiplet-ready fabric solutions), Ayar Labs (in-package optical I/O chiplets)
Key partnerships
TSMC (Taiwan Semiconductor Manufacturing Co.) for chiplet sampling and production, UCIe (Universal Chiplet Interconnect Express) standard
Notable customers
Engaged with multiple tier-one customers (names not publicly disclosed as of stealth launch)
Major milestones
July 2026: Emerged from stealth with $43M oversubscribed early-stage funding, First full-stack chiplet platform for AI infrastructure announced, TYL.IO and TYL.Power samples planned for 2027 in partnership with TSMC
Market positioning
First-mover as a pure-play full-stack chiplet platform company for AI infrastructure, positioned to democratize custom silicon development that was previously only accessible to the largest hyperscalers and merchant chip vendors
Geographic focus
Global (HQ in San Jose, CA with engineering operations in Bangalore, India)
About Mohit Gupta
Ex-Executive at Alphawave IP Group (acquired by Qualcomm for ~$2.4B); Senior roles at SiFive, Cadence Design Systems, Rambus. Education: Indian Institute of Management, Calcutta.
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Official website: https://www.tylsemi.ai